Scientific Output
Publications, proceedings, posters, patents, and related items.
- journalReflectometric Determination of Residual Oxides in Through-Silicon Vias for 3D Chip Integration, A Novel ApproachJoachim Bauer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Johanna Reck, Sven Peters, Christian Kuhnt, Alexander Treffer, Steffen Marschmeyer, Oksana Fursenko, others. 2025. Optica Open.
- journalReflectometric method for measuring residual oxides in through-silicon vias for 3D chip integrationJoachim Bauer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Johanna Reck, Sven Peters, Alexander Treffer, Christian Kuhnt, Steffen Marschmeyer, Oksana Fursenko, others. 2025. Optics Express 33(15). 32175–32189, Optica Publishing Group.
- conferenceDesign, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnectionsFrancesco Villasmunta, Patrick Steglich, Claus Villringer, Sigurd Schrader, Harald Schenk, Andreas Mai, Martin Regehly. 2024. Optical Interconnects XXIV (SPIE) 12892. 118–129, SPIE.
- patentIntegrated optical waveguidePatrick Steglich, Christian Mai, Andreas Mai, Francesco Villasmunta, Claus Villringer, Sigurd Schrader. 2024. US Patent App. 18/557,444 (2024-07-11).
- conferenceMessverfahren zur Kontrolle tiefer Siliziumstrukturen für die 3D-Chip-IntegrationJoachim Bauer, Francesco Villasmunta, Friedhelm Heinrich, Claus Villringer, Johanna Reck, Sven Peters, Alexander Treffer, Christian Kuhnt. 2023. Deutsche Gesellschaft für angewandte Optik (DGaO).
- otherOptical Through-Silicon Waveguides for 3D-Chip-InterconnectionsFrancesco Villasmunta, Patrick Steglich, Friedhelm Heinrich, Claus Villringer, Andreas Mai, Sigurd Schrader, Harald Schenk. 2023. entry provided without journal details.
- conferenceNumerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic InterconnectionsFrancesco Villasmunta, Patrick Steglich, Sigurd Schrader, Harald Schenk, Andreas Mai. 2021. International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD). 115–116, IEEE.
- otherNumerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic InterconnectionsHarald Schenk, Francesco Villasmunta, Patrick Steglich, Sigurd Schrader, Andreas Mai. 2021. IEEE. entry provided without venue details.
- journalSilicon-organic hybrid photonics: an overview of recent advances, electro-optical effects and CMOS integration conceptsPatrick Steglich, Christian Mai, Claus Villringer, Birgit Dietzel, Siegfried Bondarenko, Viachaslau Ksianzou, Francesco Villasmunta, Christoph Zesch, Silvio Pulwer, Martin Burger, others. 2021. Journal of Physics: Photonics 3(2). 022009, IOP Publishing.
- conferenceEndoscopic orientation by multimodal data fusionSilvio Pulwer, Richard Fiebelkorn, Christoph Zesch, Patrick Steglich, Claus Villringer, Francesco Villasmunta, Egbert Gedat, Jan Handrich, Sigurd Schrader, Ralf Vandenhouten. 2019. MOEMS and Miniaturized Systems XVIII (SPIE) 10931. 251–256, SPIE.
- journalGrafting of amine functions on cellulose acetate fibers by plasma processingMohammed Kajjout, Yahia Lemmouchi, Charafeddine Jama, Christian Rolando, Francesco Villasmunta, Friedhelm Heinrich, Ahmed Mazzah. 2019. Reactive and Functional Polymers 134. 40–48, Elsevier.
- posterPMMA Filled Through-Silicon Vias (TSVs) and Back Etch Process Controlled by Plasma Emission InterferometryFrancesco Villasmunta, Patrick Steglich, Christian Mai, Friedhelm Heinrich, Viachaslau Ksianzou, Sigurd Schrader, Andreas Mai. 2019. MikroSystemTechnik 2019; Congress. 1–4, VDE.
- journalSpectroscopic reflectometry for characterization of Through Silicon Via profile of Bosch etching processJoachim Bauer, Oksana Fursenko, Steffen Marschmeyer, Friedhelm Heinrich, Francesco Villasmunta, Claus Villringer, Christoph Zesch, Sigurd Schrader. 2019. Journal of Vacuum Science & Technology B 37(6). AIP Publishing.